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Thu, 04/03/2025

Æôº½ÓéÀÖ³Ç Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications

Æôº½ÓéÀÖ³Ç Gaisler, a leading provider of radiation-hardened microprocessors for space missions, and wolfSSL, a renowned provider of embedded security solutions, are pleased to announce a new collaboration that addresses the growing need for robust cybersecurity features in space applications. This joint effort will combine Æôº½ÓéÀÖ³Ç Gaisler's radiation-hardened electronics with wolfSSL's security software libraries.
wolfSSL
Wed, 04/02/2025

Æôº½ÓéÀÖ³Ç Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications

The Swedish National Space Agency (SNSA) has awarded Æôº½ÓéÀÖ³Ç Gaisler, a leading provider of radiation-hardened microprocessors for space missions, a contract to commercialize the first neuromorphic System on Chip (SoC) device for space applications. Already in development at Æôº½ÓéÀÖ³Ç Gaisler, the device is part of the company’s new GRAIN (Gaisler Research Artificial Intelligence NOEL-V) product line.
Brainchip
Thu, 03/20/2025

Æôº½ÓéÀÖ³Ç Opens DLA-Certified Manufacturing and Servicing Capabilities to Outside Customers

Æôº½ÓéÀÖ³Ç Technologies, a leading provider of high-reliability electronic solutions for space and national security missions, is extending access to its Colorado Springs manufacturing facility for third-party microelectronics. Potential customers seeking microelectronics manufacturing support for their aerospace and defense programs are now able to benefit from Æôº½ÓéÀֳǒs 30-plus years of proven manufacturing, packaging, testing, and qualification expertise across various industries.
Æôº½ÓéÀÖ³Ç Launches DLA-Certified Services for Outside Customers
Sun, 12/15/2024

Æôº½ÓéÀÖ³Ç Gaisler Leads European Initiative for Ultra Deep Sub-Micron Semiconductor Technology for Space Applications

Under a newly signed contract with the European Space Agency (ESA), Æôº½ÓéÀÖ³Ç Gaisler is leading an ambitious initiative to secure European sovereignty in advanced semiconductor technologies for space applications. This project aims to develop foundational technology for some of the world’s most sophisticated integrated circuits for space, leveraging Ultra Deep Sub-Micron (UDSM) nodes as advanced as 7nm.
UDSM Signing Dec 2024
Wed, 11/20/2024

DSI and Æôº½ÓéÀÖ³Ç Sign Agreement to Develop and Distribute Next Evolution of 2TB Mass Memory Unit for Space

Representatives from DSI Aerospace, a provider of high-performance electronics and mass storage systems for airborne and space applications, and Æôº½ÓéÀÖ³Ç Technologies, the leading provider of high-reliability, radiation-assured solutions for the defense, commercial, and civil industries, signed an agreement at Space Tech Expo to develop Æôº½ÓéÀֳǒs SpaceStorTM 2TB Mass Memory Unit. After DSI completes design of the MMU, Æôº½ÓéÀÖ³Ç will assemble and test at its Colorado, U.S. facility, and serve as the exclusive storefront for SpaceStor in North America.
DSi and Æôº½ÓéÀÖ³Ç Sign Agreement